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Demystifying Semiconductor Die Procurement
Webinar Recording

Bridging the Divide Between Semiconductor Die Manufacturers and the Processed Bare Die You Need!

Recorded June 20, 2023

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Why MIL-STD-1553 and What's New?
Webinar Recording

In this webinar, experts in MIL-STD-1553 interface and systems design share their many decades of knowledge, to provide system designers and engineers with an end-to-end overview of this fail-safe data bus protocol, along with what’s new and why it remains so ubiquitous in military platforms.

Recorded August 15, 2024

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Maximizing DC-DC Power Supply for Space
Webinar Recording

In this webinar, industry experts in hi-rel power electronics design, packaging, testing, and qualification of hybrid and space-grade PCB DC-DC power supplies, will provide the latest options and the best practices in realizing the optimal power suppliers for today's high-reliability applications.

Recorded May 2nd, 2024

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Ruggedizing COTS Components for Hi-Rel Applications
Webinar Recording

Minimize cost and extend mission life by 3X or more, while utilizing the latest Commercial-Off-the-Shelf (COTS) components, chip designs, and technology available.

Recorded September 28, 2023

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$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US
Press Release

Micross has been awarded up to $134.3 million by the DoD under the IBAS Cornerstone RESHAPE program to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging solutions.

November 27, 2023

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Bake and Package

GEIA-STD-0003 and JEP160 Long Term Storage Packaging

Devices anticipated to be stored longer than one year can avoid the risk of oxidation by enhanced packaging, including thicker bags, extra desiccant, backfilled with nitrogen or inert gas, and double bag seal.

 

J-STD-033 Dry Bake and MSL Packaging

Moisture sensitive devices are processed, maintained, and packaged with great consideration of the potential damage caused by moisture absorption into the package.

Long Term Storage Packaging

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